Thermalright TF4 4g Thermal Compound Paste for Coolers, Heat Sink TF4,
Thermalright
Thermalright TF4 4g Thermal Compound Paste for Coolers, Heat Sink TF4,\nProduct Details\n--\u3010High performance\u3011Excellent performance comes from its first-class data, thermal conductivity up to 9.5w/m.k, it has a good record of high cooling performance.\n--\u3010Stability\u3011The available temperature is -50\u2103/ +240\u2103, thermal resistance < 0.0068, density is 2.7 (25\u2103). Even in high or low temperature environment, its cooling advantage will not be affected.\n--\u3010Security\u3011It does not contain any metal particles, oil-free solvents, non conductive, non corrosive, harmless, It is friendly to CPU and GPU and will not damage electronic components.\n--\u3010Durability\u3011Thermal conductive silicone grease has long service life and low volatility, which can maintain its thermal conductivity in CPU, GPU, radiator module, chipset, sensor and other electronic components for a long time.\n--\u3010Easy to apply\u3011 The needle-type designs is convenient for appl.
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