Wonderway Sn63/Pb37 Tin Lead Solder Paste 183℃ Melting Point No-Clean Welding Soldering Tin For CELLPHONE Electronics PCB IC CPU LED BGA Repairing (20g)

Wonderway Sn63/Pb37 Tin Lead Solder Paste 183℃ Melting Point No-Clean Welding Soldering Tin For CELLPHONE Electronics PCB IC CPU LED BGA Repairing (20g)

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Paste Content: Alloy Tin 63% Pb 37%, Sloder Flux Content: 10.5% Product Parameters: Total Weight: 29g, Net Weight Of Paste: 20g Paste Features: No Clean, Strong Viscosity, Bright Welding Point Product Advantages: Pushing design for Smoother Flowing, No Waste During Welding Applications: Widely Used In Circuit Board, IC, Phone, TV and Other Household Appliances and Industrial Equipment, Weight: 20.0 grams, Manufacturer: wonderway

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