Chip QuikNo-Clean Lead-Free Solder Paste JarSn96.5/ag3/cu0.5T3 Mesh250G from B&Q
CHIP QUIK
No-clean, lead-free solder paste in 250g jar.Printing speeds up to 100mm/secLong stencil lifeWide process windowClear residueLow voidingExcellent wetting compatibility on most board finishesDispense gradeCompatible with enclosed print headsPasses BONO test @ 1.56%Shelf life: >6 months (refrigerated), >2 months (unrefrigerated)Flux Type: Synthetic No CleanSolder Alloy: 96.5, 3, 0.5 Sn, Ag, CuMelting Temperature: 220°CWeight: 250g.
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