Chip Quik No-Clean Lead-Free Thermally Stable Solder Paste Jar T4 Mesh 50G from B&Q
CHIP QUIK
No-clean, lead-free, thermally stable solder paste in 50g jar.Printing speeds up to 125mm/sec.Long stencil lifeWide process windowClear residueLow voidingExcellent wetting compatibility on most board finishesDispense gradeCompatible with enclosed print headsT4 meshAlloy: Sn96/Ag3/Cu0.5Flux Type: Synthetic No CleanSolder Alloy: 96.5, 3, 0.5 Sn, Ag, CuMelting Temperature: 220°CWeight: 50g.
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