iPhone PCB Middle Layer Reballing Fixture ReLife RL-601T X-17 Pro Max Stencil
ReLife
iPhone PCB Middle Layer Reballing Fixture ReLife RL-601T X-17 Pro Max Stencil\n\nReLife RL-601T \u2014 31-in-1 iPhone PCB Middle Layer Reballing Fixture. \uD83D\uDD39 iPhone X to iPhone 17 Pro Max \uD83D\uDD39 BGA Reballing Stencil Set \uD83D\uDD39 3-Magnet Positioning Base \uD83D\uDD39 UK Stock \u2013 Fast Dispatch\n\n\uD83D\uDD39 Description\n\nThe ReLife RL-601T is a 31-in-1 PCB middle layer reballing fixture for iPhone logic board repair.\n\nIt covers iPhone X through to iPhone 17 Pro Max on a single expandable base, so technicians can reball motherboards across multiple iPhone generations without buying a separate fixture per model.\n\nPrecision 0.12mm steel stencils line up the upper and lower PCB layers for clean solder ball placement during chip-level repair.\n\nThree built-in magnets hold the board firmly in place during reballing, and the anti-drum stencil design keeps solder balls round and consistent for microsoldering and BGA rework.\n\n\uD83D\uDD39 Key Features\n\n\u271r
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