Universal BGA Reballing Stencil Multifunctional Tin Mesh Solder Template For Pho
Feature: \n 1. FOUR PITCHES: Universal BGA reballing stencil has three types of holes with 0.3 0.35 0.375 0.4 0.5 pitch, four kinds of spacing and multiple sizes.\n2. PRECISE POSITIONING: Tin mesh solder template is precisely positioned for fast tin implantation, and the ball template will not change under high temperature.\n3. COMPACT APPEARANCE: Universal BGA reballing stencil has a compact appearance and is easy to carry around and use.\n4. VERSATILE: BGA reballing stencil is versatile and suitable for the common IC used in cell phones today, which can meet your various needs.\n5. STAINLESS STEEL MATERIAL: Tin mesh solder template is made of premium stainless steel material, which is not easily damaged and has a long service life. \n\nSpecification: \n\nItem Type: BGA Reballing Stencil\nPitch: 0.3mm/0.012in, 0.35mm/0.014in, 0.375mm/0.015in, 0.4mm/0.016in, 0.5mm/0.020in\nProduct Material: Stainless Steel\n\nPackage List: \n 1 x\n\nBGA Reballing Stencil \n\n1. Ou:
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BGA Reballing Stencil Template Stainless Steel
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