Phone Tin Reballing Stencil Accurate Positioning CPU Tin Planting Template For

--\n--\n\nFeature: \n 1. SUITABLE MODELS: The CPU tin reballing stencil is suitable for S9 and S9+ series, for Snapdragon 845 and for 9810 CPU.\n2. FAST TINNING SPEED: Our reballing stencil will not change under high temperature, and the tinning speed is fast, which can improve the efficiency of tinning.\n3. MULTIPLE IC RECESSES: Tin reballing stencil has multiple IC recesses on the main body of the stencil with half engraving process to effectively preventing small ICs from sticking to tin and protecting small ICs from breaking corners.\n4. PRECISE POSITIONING: The tin planting stencil can be precisely positioned and has a compact appearance for use in different applications.\n5. EASY TO USE: CPU tinning stencil is very portable, can be used as you go, easy to use, is a good maintenance and tools. \n\nSpecification: \n\nItem Type: Phone Tin Reballing Stencil\nMaterial: Stainless steel\nPitch: Approx. 0.12mm / 0.005in\nApplicable CPU: For Snapdragon 845 and for 9810 CPU\nA-