Phone Ic Chip Desoldering Station With Preheater And Glue Removal Table For Electronic Hdd And Power Chips 9382693065605

Phone Ic Chip Desoldering Station With Preheater And Glue Removal Table For Electronic Hdd And Power Chips 9382693065605

Key benefits Fast heating capacity: Quickly reaches glue removal temperatures between 160 and 250C, improving efficiency in mobile phone tasks.

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