Encapsulation Technologies for Electronic Applications Ardebili Zhang Pecht 2e

Encapsulation Technologies for Electronic ApplicationsAuthor(s): Haleh Ardebili, Jiawei Zhang, Michael G. Pecht\nFormat: Paperback\nPublisher: William Andrew Publishing, United States\nImprint: William Andrew Publishing\nISBN-13: 9780128119785, 978-0128119785\nSynopsis\nEncapsulation Technologies for Electronic Applications, Second Edition, offers an updated, comprehensive discussion of encapsulants in electronic applications, with a primary emphasis on the encapsulation of microelectronic devices and connectors and transformers. It includes sections on 2-D and 3-D packaging and encapsulation, encapsulation materials, including environmentally friendly 'green' encapsulants, and the properties and characterization of encapsulants. Furthermore, this book provides an extensive discussion on the defects and failures related to encapsulation, how to analyze such defects and failures, and how to apply quality assurance and qualification processes for encapsulated packages. \n\nIn addition,.