Reliability and Failure Analysis of High-Power LED Packaging - 9780128224083

Reliability and Failure Analysis of High-Power LED PackagingAuthor(s): Cher Ming Tan, Preetpal Singh\nFormat: Paperback\nPublisher: Elsevier Science Publishing Co Inc, United States\nImprint: Woodhead Publishing\nISBN-13: 9780128224083, 978-0128224083\nSynopsis\nReliability and Failure Analysis of High-Power LED Packaging provides fundamental understanding of the reliability and failure analysis of materials for high-power LED packaging, with the ultimate goal of enabling new packaging materials. This book describes the limitations of the present reliability standards in determining the lifetime of high-power LEDs due to the lack of deep understanding of the packaging materials and their interaction with each other. Many new failure mechanisms are investigated and presented with consideration of the different stresses imposed by varying environmental conditions. The detailed failure mechanisms are unique to this book and will provide insights for readers regarding the possible failur.