Lead-free Soldering Process Development and Rel, Bath Hardcover^+

Lead-free Soldering Process Development and ReliabilityAuthor(s): Jasbir Bath\nFormat: Hardback\nPublisher: John Wiley & Sons Inc, United States\nImprint: John Wiley & Sons Inc\nISBN-13: 9781119482031, 978-1119482031\nSynopsis\nCoveringthe majortopics in lead-free soldering\n\n Lead-free Soldering Process Development and Reliabilityprovides a comprehensive discussion of all modern topics in lead-free soldering. Perfect forprocess, quality,failure analysisand reliability engineersin production industries,this reference will help practitioners address issues inresearch, development andproduction.\n\n Among other topics, the book addresses:\n\nDevelopments in process engineering(SMT, Wave, Rework, Paste Technology)\n\nLowtemperature,hightemperature andhighreliabilityalloys\n\nIntermetallic compounds\n\nPCB surface finishesandlaminates\n\nUnderfills, encapsulants and conformal coatings\n\nReliability assessments\n\n In a regulatory environment that includes the adoption of mandat.