Introduction to Microsystem Packaging Technology - 9781138374256

CRC Press

Introduction to Microsystem Packaging TechnologyAuthor(s): Yufeng Jin, Zhiping Wang, Jing Chen\nFormat: Paperback\nPublisher: Taylor & Francis Ltd, United Kingdom\nImprint: CRC Press\nISBN-13: 9781138374256, 978-1138374256\nSynopsis\nThe multi-billion-dollar microsystem packaging business continues to play an increasingly important technical role in todays information industry. The packaging processincluding design and manufacturing technologiesis the technical foundation upon which function chips are updated for use in application systems, and it is an important guarantee of the continued growth of technical content and value of information systems.\n\nIntroduction to Microsystem Packaging Technology details the latest advances in this vital area, which involves microelectronics, optoelectronics, RF and wireless, MEMS, and related packaging and assembling technologies. It is purposefully written so that each chapter is relatively independent and the book systematically presents .