Stochastic Finite Element Modeling in Electronic Packaging.by Chu, Chu, New**

John Wiley & Sons Inc

Stochastic Finite Element Modeling in Electronic PackagingAuthor(s): Liu Chu\nFormat: Hardback\nPublisher: John Wiley & Sons Inc, United States\nImprint: Wiley-IEEE Press\nISBN-13: 9781394352944, 978-1394352944\nSynopsis\nAn expert integration of digital twin technology and advanced simulation methods for the design and optimization of electronic packaging systems \n\nIn Stochastic Finite Element Modeling in Electronic Packaging, distinguished researcher Liu Chu delivers an expert discussion of the latest advanced numerical methods and modeling techniques specific to electronic packaging. The book supplements its explanations with original MATLAB and ANSYS (APDL) code that can be applied immediately. It also includes robust examples that draw on a comprehensive description of the mechanics of electronic packaging modeling. \n\nChu explains the fundamentals of modeling logic and concepts in an accessible way that is ideal for beginners to the topic. She demonstrates practical guid.