Thermal Management Materials for Electronic Pac. Tian**

Wiley-VCH Verlag GmbH

Thermal Management Materials for Electronic Packaging: Preparation, Characterization, and Devices\nby Xingyou Tian\nHardback\nEnglish\n\nDelivery\nUsually delivered in 2\u20133 working days (dispatched today if ordered before 3pm).\n\nBrand new copy from BookCurl \u2013 the UK independent online bookseller.\n\n------------------------------\nBook details\n------------------------------\nAuthor: Xingyou Tian\nTitle: Thermal Management Materials for Electronic Packaging: Preparation, Characterization, and Devices\nFormat: Hardback\nLanguage: English\nTopic: Mechanical engineering and materials\nPublisher: Wiley-VCH Verlag GmbH\nPublication year: 2024\nISBN-13: 9783527352425\nISBN-10: 3527352422\nRRP: \u00A3150.00\n\n------------------------------\nDescription\n------------------------------\nThermal Management Materials for Electronic Packaging \nPractical resource exploring the theoretical and experimental basis as well as solutions for the development of new thermal management materi.