Encapsulation Technologies for Electronic Appli, Dr., Pecht,#

Encapsulation Technologies for Electronic ApplicationsAuthor(s): Haleh Ardebili, Michael G. Pecht\nFormat: Hardback\nPublisher: William Andrew Publishing, United States\nImprint: William Andrew Publishing\nISBN-13: 9780815515760, 978-0815515760\nSynopsis\nElectronics are used in a wide range of applications including computing, communication, biomedical, automotive, military and aerospace. They must operate in varying temperature and humidity environments including indoor controlled conditions and outdoor climate changes. Moisture, ionic contamination, heat, radiation and mechanical stresses are all highly detrimental to electronic devices and can lead to device failures. Therefore, it is essential that the electronic devices be packaged for protection from their intended environments, as well as to provide handling, assembly, electrical and thermal considerations. Currently, more than 99% of microelectronic devices are plastic encapsulated. Improvements in encapsulant materials, an.